Hoʻolālā ʻia ʻo R4900 G5 no nā hiʻohiʻona:
- Virtualization - Kākoʻo i nā ʻano hana nui ma kahi kikowaena hoʻokahi e maʻalahi i ka Infra-investment.
- ʻIkepili Nui - Mālama i ka ulu nui o nā ʻikepili i kūkulu ʻia, ʻaʻole i hoʻonohonoho ʻia, a me nā semi-structured data.
- Hoʻohana koʻikoʻi mālama - hoʻokuʻu i ka bottleneck hana
- Hale kūʻai / ʻikepili - Huli i ka ʻikepili i ke koi e kōkua i ka hoʻoholo lawelawe
- Hoʻokele pilina o nā mea kūʻai aku (CRM) - E kōkua iā ʻoe e loaʻa i nā ʻike piha i ka ʻikepili ʻoihana e hoʻomaikaʻi i ka ʻoluʻolu o ka mea kūʻai aku a me ka kūpaʻa.
- Hoʻolālā waiwai waiwai (ERP) - E hilinaʻi i ka R4900 G5 e kōkua iā ʻoe e hoʻokele i nā lawelawe i ka manawa maoli
- (Virtual Desktop Infrastructure)VDI — Hoʻolālā i nā lawelawe papapihi mamao e hoʻolako i kāu poʻe limahana me ka maʻalahi hana i kēlā me kēia manawa, ma nā wahi āpau.
- Ka helu helu hana kiʻekiʻe a me ke aʻo hohonu - Hāʻawi i nā GPU kūpono e kākoʻo i ka aʻo mīkini a me nā noi AI
- Nā kiʻi kiʻi kikowaena ʻikepili hale no ka pāʻani kapuaʻi kiʻekiʻe a me ke kahe ʻana o ka media
- Kākoʻo ka R4900 G5 i nā ʻōnaehana hana Microsoft® Windows® a me Linux, a me VMware a me H3C CAS a hiki ke hana maikaʻi i nā kaiapuni IT heterogeneous.
Kūlana ʻenehana
| CPU | 2 x 3rd generation Intel® Xeon® Ice Lake SP series (kēlā me kēia kaʻina hana a hiki i 40 cores a me ka nui o ka hoʻohana mana 270W) |
| Chipset | Intel® C621A |
| Hoʻomanaʻo | 32 x DDR4 DIMM slots, kiʻekiʻe 12.0 TBUp i 3200 MT/s ka helu hoʻoili data, kākoʻo iā RDIMM a i ʻole LRDIMM A hiki i ka 16 Intel ® Optane™ DC Persistent Memory Module PMem 200 series ( Barlow Pass) |
| Mea mālama mālama | Hoʻokomo ʻia ka mea hoʻoponopono RAID (SATA RAID 0, 1, 5, a me 10) ʻO ka mea hoʻoponopono PCIe HBA maʻamau a i ʻole ka mea mālama mālama, ma muli o ke kumu hoʻohālike. |
| FBWC | 8 GB DDR4 cache, ma muli o ke kumu hoʻohālike, kākoʻo i ka pale supercapacitor |
| Waihona | A hiki i mua 12LFF kai, loko 4LFF kai, hope 4LFF+4SFF kai*A hiki i mua 25SFF kai, loko 8SFF kai, hope 4LFF+4SFF kai* Mua/Kuloko SAS/SATA HDD/SSD/NVMe Drives, ka nui 28 x U.2 NVMe Drives SATA a i ʻole PCIe M.2 SSDs, 2 x kāki kāleka SD, ma muli o ke kumu hoʻohālike |
| Pūnaewele | 1 x ma luna o 1 Gbps pūnaewele hoʻokele port2 x OCP 3.0 mau mākia no 4 x 1GE a i ʻole 2 x 10GE a i ʻole 2 x 25GE NIC Nā kau maʻamau PCIe no 1/10/25/40/100/200GE/IB Ethernet adapter |
| Nā ʻāpana PCIe | 14 x PCIe 4.0 mau mākia maʻamau |
| Awa | Nā awa VGA (Mua a me Mua) a me ke awa serial (RJ-45) 6 x USB 3.0 awa (2 mua, 2 hope, 2 kūloko) 1 hoʻokohu hoʻokele Type-C awa |
| GPU | 14 x hoʻokahi-slot ākea a i ʻole 4 x pālua-slot wide GPU modules |
| ʻO ka hoʻokele Optical | ʻO ka disk drive optical waho, koho |
| Hooponopono | ʻO ka ʻōnaehana HDM OOB (me ke awa hoʻokele i hoʻolaʻa ʻia) a me ka H3C iFIST/FIST, LCD hoʻohālike akamai hiki ke hoʻopā ʻia. |
| Palekana | Naʻauao Pale Palekana Bezel *Chassis Intrusion Detection TPM2.0 ʻO ke kumu hilinaʻi Silicon ʻO ka palapala ʻae ʻelua kumu |
| Lako ikehu | 2 x Platinum 550W/800W/850W/1300W/1600W/2000/2400W (1+1 redundancy), e pili ana i ke kumu hoʻohālike 800W –48V DC mana lako (1+1 Redundancy)Hot swappable redundant fans |
| Nā kūlana | CE，UL, FCC, VCCI, EAC, etc. |
| Hana wela | 5°C a i 45°C (41°F a 113°F) ʻokoʻa ka mahana hana kiʻekiʻe ma muli o ka hoʻonohonoho kikowaena. No ka ʻike hou aku, e ʻike i ka palapala ʻenehana no ka hāmeʻa. |
| Nā Ana (H×W × D) | 2U Kiʻekiʻe me ka ʻole o ka bezel palekana: 87.5 x 445.4 x 748 mm (3.44 x 17.54 x 29.45 in) Me ka bezel palekana: 87.5 x 445.4 x 776 mm (3.44 x 17.54 x 30.55 in) |
Hōʻike Huahana
