HIʻona
Kākoʻo ke kikowaena R4300 G3 a hiki i ka 52 drive, koho maʻemaʻe mai ka M.2 a i nā drive NVMe a me ka hui pū ʻana o NVDIMM/DCPMM maʻalahi a me Optane SDD/NVMe flash kiʻekiʻe.
Me ka 10 PCIe 3.0 slots a hiki i ka 100 GB Ethernet card 56Gb, 100Gb IB card, hiki i ka Server ke hoʻokō maʻalahi i ka hoʻonui I/O hilinaʻi a maʻalahi e hāʻawi i ka leo kiʻekiʻe a me ka lawelawe data concurrent.
Kākoʻo ʻo R4300 G3 Server i nā lako mana me 96% pono e hoʻomaikaʻi nui i ka pono kikowaena data a hoʻemi i ke kumukūʻai datacenter.
Hāʻawi ʻo R4300 G3 i kahi hoʻonui laina kūpono o ka hiki ke mālama i ka pae DC. Hiki iā ia ke kākoʻo i nā ʻano ʻenehana Raid he nui a me ka ʻenehana pale ʻana i ka mana e hoʻolilo i ke kikowaena i mea hoʻolālā kūpono no SDS a i ʻole ka waiho ʻana i ka mālama ʻana,
- ʻIkepili Nui - hoʻokele i ka ulu nui o ka nui o ka ʻikepili e pili ana i ka ʻikepili i kūkulu ʻia, ʻaʻole i hoʻonohonoho ʻia, a me nā ʻikepili semi-structured.
- Ke noi no ka mālama ʻana - hoʻopau i nā bottlenecks I / O a hoʻomaikaʻi i ka hana
- Waihona ʻikepili/Analysis – unuhi i ka ʻike waiwai no ka hoʻoholo ʻana i ka naʻauao
- Ka hana kiʻekiʻe a me ka hoʻonaʻauao hohonu– Ke hoʻoikaika nei i ka aʻo ʻana i ka mīkini a me nā noi hana naʻauao
Kākoʻo ka R4300 G3 i nā ʻōnaehana hana Microsoft® Windows® a me Linux, a me VMware a me H3C CAS a hiki ke hana maikaʻi i nā kaiapuni IT heterogeneous.
Kūlana ʻenehana
Heluhelu | 2 × Intel® Xeon® Scalable processors (A hiki i 28 cores a me 165 W mana hoʻohana nui loa) |
Chipset | Intel® C621 |
Hoʻomanaʻo | 24 × DDR4 DIMMs 3.0 TB (kiʻekiʻe)(A hiki i 2933 MT/s ka helu hoʻoili ʻikepili a me ke kākoʻo no RDIMM a me LRDIMM)(A hiki i 12 Intel ® Optane™ DC Persistent Memory Module.(DCPMM) NVDIMM koho* |
Mea mālama mālama | Hoʻokomo ʻia ka mea hoʻoponopono RAID (SATA RAID 0, 1, 5, a me 10) Kāleka Mezzanine HBA (SATA/SAS RAID 0, 1, a me 10) (Kūpono) Mezzanine mea mālama mālama (RAID 0, 1, 5, 6, 10, 50, 60, 1E a me ka Volume maʻalahi) (Koho) Kāleka PCIe HBA maʻamau a me nā mea mālama mālama (Kūpono) NVMe RAID |
FBWC | 4 GB kahi huna |
Waihona | Kākoʻo iā SAS/SATA/NVMe U.2 DrivesFront 24LFF; Hope 12LFF+4LFF(2LFF)+4SFF; Kākoʻo i loko o 4LFF* a i ʻole 8SFF*;Ke koho 10 NVMe drive Kākoʻo SATA M.2 ʻāpana koho. |
Pūnaewele | 1 × ma luna o 1 Gbps HDM hoʻokele Ethernet port a me 2 x GE Ethernet port1 × FLOM Ethernet adapter e hāʻawi ana i nā awa keleawe 4 × 1GE; 2 × 10GE mau awa pulu; Kākoʻo ʻo FLOM i ka hana NCSI PCIe 3.0 Ethernet adapters (koho), Kākoʻo 10G,25G,100G LAN Kāleka a i ʻole 56G/100G IB kāleka |
Nā ʻāpana PCIe | 10 × PCIe 3.0 slots (8 mau mākia maʻamau, hoʻokahi no ka mea mālama mālama Mezzanine, a hoʻokahi no Ethernet adapter) |
Awa | Hoʻohui VGA hope a me nā mea hoʻohui port3 × USB 3.0 (ʻelua ma hope a hoʻokahi ma mua) |
GPU | 8 × mānoanoa hoʻokahi laula a i ʻole 2 x mau ʻāpana GPU lua-lua* |
ʻO ka hoʻokele Optical | ʻO ka hoʻokele optical waho |
Hooponopono | HDM (me ke awa hoʻokele hoʻolaʻa) a me H3C FIST |
Palekana | Kākoʻo Chassis Intrusion DetectionTPM2.0 |
Hāʻawi mana a me ka hoʻoluʻu | 2 x 550W/850W/1300W a i ʻole 800W –48V DC nā lako mana (1+1 Redundant Power Supply)80Plus palapala hōʻoia, a hiki i ka 94% ikehu hoʻololi maikaʻi ʻO nā mea pā hiki ke hoʻololi ʻia (kākoʻo iā 4+1 Redundancy) |
Nā kūlana | CE,UL, FCC, VCCI, EAC, etc. |
Ka wela hana | 5oC a hiki i 40oC (41oF a 104oF)Ka Mahana Waihona:-40~85ºC(-41oF a 185oF) ʻOkoʻa ka mahana hana kiʻekiʻe ma muli o ka hoʻonohonoho kikowaena. No ka ʻike hou aku, e ʻike i ka palapala ʻenehana no ka hāmeʻa. |
Nā Ana (H×W × D) | 4U Kiʻekiʻe ʻAʻohe bezel palekana: 174.8 × 447 × 782 mm (6.88 × 17.60 × 30.79 in)Me ka bezel palekana: 174.8 × 447 × 804 mm (6.88 × 17.60 × 30.79 in) |